Pwosesis kapasite
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PCB kapasite fabrikasyon |
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Kategori |
Sijè |
Estanda |
Avanse |
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Fondamantal |
Rijid PCB Konte Kouch |
1-36L |
60L |
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Flex & rijid - Flex PCB Konte Kouch |
Flex PCB: 1-10L |
Flex PCB: 1-16L |
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Rijid - Flex PCB: 2-20L |
Rijid - Flex PCB+HDI: 2-20L |
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Min. Epesè tablo fnished |
0.2 ± 0.05mm (8 ± 2mil) |
0.15 ± 0.025mm (6 ± 1mil) |
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Max. Epesè tablo fnished |
6.5 ± 10%mm (256 ± 10%mil) |
10.0 ± 10%mm (394 ± 10%mil) |
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Max.board/gwosè etalaj |
1060mm*610mm (41*24inch) |
1100mm*660mm (43*26inch) |
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Min. Epesè debaz |
0.05mm (2mil) |
0.034mm (1.34mil) |
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Anpile |
Atravè - twou PCB |
Wi |
Wi |
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Mekanik - avèg/antere via PCB |
Wi |
Wi |
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Metal baz PCB |
Wi |
Wi |
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Om |
1+N+1 |
Rijid - Flex PCB+HDI |
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1+1+N+1+1,2+N+2 |
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1+1+1+N+1+1+1,3+N+3 |
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Anylayer |
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Baz materyèl |
Nòmal TG, Mwayen TG, segondè TG |
Wi |
Wi |
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Plon gratis, alojene gratis |
Wi |
Wi |
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Low DK Plastifye |
Wi |
Wi |
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Low Pèt Plastifye |
Wi |
Wi |
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Segondè frekans Plastifye |
Wi |
Wi |
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PI Plastifye |
Wi |
Wi |
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BT Plastifye |
Wi |
Wi |
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Tflon Plastifye |
Wi |
Wi |
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Founisè materyèl |
Shengyi, Iteq, KB, Tuc, Grace |
Wi |
Wi |
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Isola, Ventec, Nanya, Dopont |
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Arlon, Rogers, wangling, Taconic |
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Bergquist, Boyu, Nelco |
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Trou |
Min. Gwosè egzèsis mekanik |
0.15mm (6mil) |
0.10mm (4mil) |
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Min. Gwosè egzèsis lazè |
0.10mm (4mil) |
0.075mm (3mil) |
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Twou perçage nan presizyon twou |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
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Pth tolerans |
± 0.075mm (± 3mil) |
± 0.05mm (± 2mil) |
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NPTH tolerans |
± 0.05mm (± 2mil) |
± 0.038mm (± 1.5mil) |
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Kontwole pwofondè perçage tolerans |
± 0.10mm (± 4mil) |
± 0.05mm (± 2mil) |
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Rapò aspè PTH |
10:1 |
15:1 |
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Rapò aspè laswer |
0.8:1 |
1:1 |
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Min. Distans twou a tras |
7mil |
6.5mil |
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Trase, Soldermask |
Min. Trase lajè/espas |
0.075mm/0.075mm (3/3mil) |
0.05mm/0.05mm (2/2mil) |
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Trase tolerans lajè |
± 10% |
± 8% |
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Min. Sèvi Cu epesè |
12um (1/3 oz) |
9um (1/4 oz) |
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Max. Sèvi Cu epesè |
12 oz |
12 oz |
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Tolerans kontwòl enpedans |
± 10% |
± 5% |
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Enskripsyon ＜ 10L |
± 0.05mm (± 2mil) |
± 0.038 (± 1.5mil) |
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Enskripsyon pi gran pase oswa egal a 10L |
± 0.075 (± 3mil) |
± 0.05 (± 2mil) |
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Min. SMT/QFP anplasman |
0.20mm (8mil) |
0.15mm (6mil) |
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Min. BGA anplasman |
0.23mm (9mil) |
0.20mm (8mil) |
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Min. Lajè pon soude |
3mil |
3mil |
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S/M Enskripsyon Tolerans |
± 0.05mm (± 2mil) |
± 0.038mm (± 1.5mil) |
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Mekanik |
Routage tolerans |
± 0.13mm (± 5mil) |
± 0.10mm (± 4mil) |
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Punch tolerans |
± 0.10mm (± 4mil) |
± 0.05mm (± 2mil) |
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V - Koupe kote tolerans |
± 0.10mm (± 4mil) |
± 0.075mm (± 3mil) |
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V - Koupe tolerans rezidyèl |
± 0.10mm (± 4mil) |
± 0.05mm (± 2mil) |
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Ang & tolerans nan beveling nan g/f |
20 degre /30 degre /45 degre, ± 5 degre |
20 degre /30 degre /45 degre, ± 5 degre |
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Pwofondè & tolerans nan beveling nan g/f |
1.2 ± 0.20mm (47 ± 8mil) |
1.2 ± 0.10mm (47 ± 4mil) |
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Sifas fini |
Kabòn lank |
Nipon |
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Mask Peelable |
Peter SD2955 |
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OSP |
Entek Plus ht; Preflux f2 lx |
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Enig |
Au: 0.03um -0.06um, Ni: 3um -6um |
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Enig+OSP |
Wi |
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Fèblan imèsyon |
0.8-1.2um |
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Immersion ajan |
Wi |
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Hasl (gratis) |
0.5-40um |
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ENeIPG |
AU: 0.015-0.075um; PD: 0.02-0.075um; Ni: 2-6um |
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Electro. Difisil lò |
AU: 0.125-1.270um; NI: 2.50-6.25um |
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Pwosesis espesyal |
Platd kwen |
Wi |
Wi |
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Mwatye twou |
Wi |
Wi |
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Sidestep twou |
Wi |
Wi |
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Via nan pad |
Wi |
Wi |
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Retounen PRORE |
Wi |
Wi |
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Countersink twou |
Wi |
Wi |
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Avanse |
Antere kondansateur |
Wi |
Wi |
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Antere rezisteur |
Wi |
Wi |
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Entegre pyès monnen |
Wi |
Wi |
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Rijid - Flex |
Wi |
Wi |
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Rijid - Flex + HDI |
Wi |
Wi |
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Substra |
Non |
Non |
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Rijid - Flex + baz metal |
Non |
Non |
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